HTOL vs. Burn-In: Can One System Support Both?

Start with the purpose of each test

High temperature operating life (HTOL) evaluates device reliability under elevated-temperature operating conditions. It is used for qualification and reliability evaluation or monitoring.

Here, semiconductor burn-in means production screening intended to identify early-life failures. Suppliers may use “burn-in” more broadly, so state the production-screening context in the request.

Changing run duration alone does not make a production screening program suitable for HTOL. The required device operation, electrical evaluation and result criteria also matter.

JESD22-A108, Temperature, Bias, and Operating Life, is a method reference for HTOL. Use the edition specified by the approved plan or customer specification. SANWOOD's JEDEC reliability test guide provides method background; the semiconductor reliability testing overview covers the wider application context.

Review the changeover between tasks

An existing burn-in board (BIB) may accommodate the same device under test (DUT) in both setups while the HTOL plan requires a different operating program or electrical checks. Keeping the board and retaining the program are separate decisions.

Ask the supplier to describe the changeover in four areas:

• Chamber and loaded layout. Request thermal evidence for the proposed device quantity, board arrangement and operating load. Clarify whether the temperature requirement refers to chamber air, device case or junction temperature, and how that reference will be established.

• BIB and sockets. Review package fit, electrical connections and suitability for the specified thermal and electrical conditions in both plans. Request the relevant fixture or interface documents.

• Power, stimulus and measurement hardware. Identify the functions shared between tasks and any changes needed to device operation or measurements. Confirm which equipment the supplier includes and which the customer or another supplier provides.

• Programs and records. Identify the program used for each task, its required checks, the acceptance criteria and the reports it produces. Request verification records and representative reports for the proposed use.

For each area, record one conclusion: reuse unchanged, reuse after a defined change, or further review needed. A board that fits both setups does not establish that the same program or measurements will satisfy both plans. Keep those decisions separate in the proposal.

Check equipment availability and changeover

A technically suitable shared setup may still be difficult to schedule. Check whether the planned HTOL run can remain uninterrupted while production burn-in capacity is needed. Include loading, unloading, program changes and the checks required before releasing the system for the next task.

Agree who confirms the board arrangement, selected program and run identification after each changeover. Document the checks needed for the next task, together with the time allowed for them.

Define what TDBI includes

TDBI means Test During Burn-In: electrical testing during burn-in, including checks of device response. It describes a testing approach rather than a separate qualification or screening objective.

Applying bias, operating a device and measuring its response are distinct functions. For TDBI, specify which responses are checked, when the checks occur, the required coverage and the device-level records.

Where external instruments or automatic test equipment (ATE) are required, identify who supplies them and which measurements they provide.

Questions before approving shared use

Can HTOL and production burn-in run simultaneously?

Sharing a system does not establish simultaneous operation. For concurrent runs, request confirmation of the proposed thermal and electrical control arrangement, run identification and verification under the combined operating load.

Does a different DUT load require another review?

Recheck the affected configuration when device quantity, board layout or device operation changes. Ask whether the existing thermal and electrical evidence covers the revised setup, and identify any further verification needed.

Can HTOL and burn-in use the same report template?

A common template may be suitable if it distinguishes each task's purpose, device identification, conditions, program version and acceptance criteria. Request example reports for both tasks before agreeing the reporting scope.

Discuss the proposed configuration with SANWOOD

SANWOOD's Memory Burn-in Test Systems category includes the BIB Memory Burn-in Test System and the Integrated Circuit High-Temperature Dynamic Aging Test System. These are separate product configurations. Suitability for HTOL, production burn-in or shared use requires engineering review of the proposed setup.

Send SANWOOD one summary for HTOL and another for production burn-in. Include:

• Device under test (DUT), package, sample quantity, BIB/socket arrangement and existing boards proposed for reuse.

• Applicable plan and edition, temperature conditions, duration, measurement reference and expected operating power information, if available.

• Bias, power, stimulus, response checks, additional measurements and existing programs proposed for reuse.

• Required records, device or lot identification, acceptance criteria, and supplier and customer responsibilities.

• Planned system occupation, the production screening schedule and the time available for task changeover.

Ask SANWOOD to identify shared hardware, changes between tasks, quotation inclusions and exclusions, and verification responsibilities in the proposal.