Two zone Thermal Shock Test Chamber

• •Pneumatic Lift Carrier Dynamics: Engineered with high-torque industrial pneumatic cylinders and dual-guide balancing tracks, delivering low-vibration sample transport that avoids artificial mechanical rattling of delicate electronic components.
• •Dual-Zone Thermodynamic Storage: This climatic test chamber integrates an intelligent thermodynamic pre-conditioning loop, maximizing available cooling and heating capacity to hit strict temperature recovery windows under full load.
• •Adaptive Dew-Point Suppression: This environmental test chamber interlocks automatic dry air purging arrays during basket transitions, establishing a low-moisture barrier that eradicates terminal frosting and moisture shorting on biased DUT pins.

• •Automotive (LV124/MIL-STD): Tests powertrain modules, autonomous compute units, and high-voltage BMS systems under aggressive thermal shock inside the environmental test chamber.
• •IC Lead Frame & Advanced Packaging OSAT Lines: Exposes hidden structural defects, delamination arcs, and micro-void tracking in multi-die SiP and Flip-Chip BGA assemblies via rapid thermal transitions.

• •Aerospace & Defense: Executes rigorous air-to-air transition environments to qualify cockpit avionics, mission-critical processing nodes, and tactical instrumentation arrays.

• •Multi-Layer PCB Assemblies & SMT Solder Integrity: Subjects high-density telecommunication infrastructure boards to intense contraction-expansion thermal cycling to surface microscopic solder joint fractures.

• •MIL-STD-810H Method 503.7: Temperature Shock Testing (Rules strict air-to-air transition timelines to assess structural survival margins across weapon-grade electronics inside an environmental test chamber setup).
• •IEC 60068-2-14 (Test Na): Change of Temperature - Rapid Transition (Standardizes rapid basket movement and chamber temperature recovery window limits to ensure inter-lab data correlation across a climatic test chamber line).
• •JEDEC JESD22-A106: Semiconductor Thermal Shock (Targets solid-state SMD component lots to precipitate packaging micro-voids, wire bond lifts, and die-attach interfacial delaminations).
• •ISO 16750-4 Section 5.3: Automotive Climatic Loads - Shock (Evaluates powertrain electronics, high-voltage BMS nodes, and autonomous sensors against harsh splash and transient micro-climate stress).
• •MIL-STD-202H Method 107: Thermal Shock for Electronic Parts (Thermal Shock for Electronic Parts).

The control system of the Sanwood test chamber adopts the world's leading software and hardware system to ensure that the test chamber operates under preset conditions, provide accurate and reliable experimental data, and help users achieve precise control and data collection of various experimental conditions.

• •Controller: It adopts the controller imported from South Korea Sanwon and the self-developed control system, which can be equipped with Siemens control system and equipped with RS232, RS485 and Ethernet communication ports.
• •Programmable control: It supports setting experimental programs, such as heating, cooling, constant temperature time, etc., and can execute multiple program settings, and supports advance reservation startup function.
• •Multiple languages optional: English, Korean, Russian, Chinese and Japanese.
• •Remote monitoring: Using network remote technology to achieve remote control, the test chamber can be monitored at any time, and the current data can be viewed through the user's PC and mobile phone, which improves the convenience of testing.

The specific control system of the test chamber will vary depending on the model. Please read the "Sanwood Environmental Test Chamber Manual" carefully before use and comply with the safety operating procedures.

The refrigeration system of the test chamber is a complex and important system. The stability of the refrigeration system is crucial to the accuracy and reliability of the test results.

• •Sanwood Technology has developed a refrigerant hot gas defrosting technology, which effectively melts the frost on the evaporator by injecting high-temperature and high-pressure refrigerant steam into the heat exchanger in the test chamber. This not only ensures that the evaporator does not frost, but also greatly reduces the energy consumption of the equipment.
• •The refrigeration unit adopts an internationally renowned brand.
• •Optimize the layout of the refrigeration system, and adopt VRF (refrigerant flow control) technology based on the PID cold end output principle to achieve low-temperature energy-saving operation, which can reduce energy consumption by 30% under low-temperature conditions.
• •The refrigeration system adopts a modular design, with low failure rate, few welding points, high refrigeration efficiency, good reliability, simple maintenance, and low maintenance cost.