Sanwood Technology's Temperature Forcing Systems deliver high-velocity, localized thermal airstreams directly to the device under test (DUT), eliminating the thermal mass latency inherent in conventional bulk climatic chambers. Engineered for advanced semiconductor characterization, wafer-level reliability verification, and seamless ATE interface integration, this platform transitions from extreme cryogenic baselines to high-temperature thresholds in seconds.
This localized thermal injection is critical for tracking real-time parametric drift, verifying wide-bandgap semiconductor (SiC/GaN) stability, and exposing latent IC package thermal faults in absolute alignment with JEDEC and AEC-Q100 protocols.