Rapid-Rate Temperature Change Chambers (ESS)

• •Intrinsic Linear Tracking Logic: Utilizes advanced thermodynamic control algorithms ensuring the set ramp rate remains rigid from sub-zero limits to peak heating boundaries, eliminating velocity decay.
• •Volumetric Airflow Equilibrium: Engineered with high-volume optimized blower wheels to minimize boundary-layer thermal resistance, delivering uniform thermal delivery across the complete chamber volume.
• •Dynamic EEV Energy Matching: Features automated electronic expansion valves that micro-tune refrigerant output based on real-time slope feedback, suppressing overshoots and optimizing energy efficiency.
• •Reinforced Hermetic Enclosure: Employs high-density polyurethane insulation paired with multi-layer silicone structural breaks, preventing ambient moisture infiltration and minimizing internal frosting during continuous runs.

• •Automotive Component Screening: Critical electronic control units (ECUs), high-power inverters, and autonomous sensor arrays.

  Value: Delivers exact thermal repeatability required to meet rigid automotive qualification criteria.

• •Semiconductor Package Reliability Assessment: Advanced multi-chip BGA arrays, memory chipsets, and discrete power devices.

  Value: Induces precise thermomechanical shear stress to accelerate component CTE mismatch isolation.

• •Aerospace Electronics Testing: Mission-critical avionics computers, remote telemetry nodes, and specialized communication grids.

  Value: Executes uncompromising ESS screening to fulfill rigid mission survival metrics.

• •Electronics: To test and evaluate functions and reliability of electric parts for mobile phones, laptops, and chipset, etc., under extreme fast temperature change conditions.

• •MIEC 60068-2-14: Environmental Testing - Change of Temp (Standardizes high-rate cycling parameters to analyze structural drift constraints and evaluate device physical boundaries).
• •JEDEC JESD22-A104: Semiconductor Temperature Cycling (Specifies linear thermal ramp acceleration and dwell holds to force internal material interfaces to reveal hidden delaminations).
• •MIL-STD-810H Method 503.7: Temperature Shock / Cycling Profiles (Conditions high thermal energy transitions to diagnose structural breakdown limits across electronic chassis platforms).

The control system of the Sanwood test chamber adopts the world's leading software and hardware system to ensure that the test chamber operates under preset conditions, provide accurate and reliable experimental data, and help users achieve precise control and data collection of various experimental conditions.

• •Controller: It adopts the controller imported from South Korea Sanwon and the self-developed control system, which can be equipped with Siemens control system and equipped with RS232, RS485 and Ethernet communication ports.
• •Programmable control: It supports setting experimental programs, such as heating, cooling, constant temperature time, etc., and can execute multiple program settings, and supports advance reservation startup function.
• •Multiple languages optional: English, Korean, Russian, Chinese and Japanese.
• •Remote monitoring: Using network remote technology to achieve remote control, the test chamber can be monitored at any time, and the current data can be viewed through the user's PC and mobile phone, which improves the convenience of testing.

The specific control system of the test chamber will vary depending on the model. Please read the "Sanwood Environmental Test Chamber Manual" carefully before use and comply with the safety operating procedures.

The refrigeration system of the test chamber is a complex and important system. The stability of the refrigeration system is crucial to the accuracy and reliability of the test results.

• •Sanwood Technology has developed a refrigerant hot gas defrosting technology, which effectively melts the frost on the evaporator by injecting high-temperature and high-pressure refrigerant steam into the heat exchanger in the test chamber. This not only ensures that the evaporator does not frost, but also greatly reduces the energy consumption of the equipment.
• •The refrigeration unit adopts an internationally renowned brand.
• •Optimize the layout of the refrigeration system, and adopt VRF (refrigerant flow control) technology based on the PID cold end output principle to achieve low-temperature energy-saving operation, which can reduce energy consumption by 30% under low-temperature conditions.
• •The refrigeration system adopts a modular design, with low failure rate, few welding points, high refrigeration efficiency, good reliability, simple maintenance, and low maintenance cost.