Website: Sanwood
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Three zone Thermal Shock Test Chamber

Validating fragile microelectronics, heavy battery packs, and wired sensor assemblies against catastrophic temperature shocks requires absolute mechanical isolation. Traditional two-zone vertical basket chambers introduce severe structural acceleration and pull complex testing cables during transit, which can trigger false connection dropouts or stress micro-solder joints.

Sanwood's Three-Zone Thermal Shock Test Chamber completely eliminates this mechanical backlash. Engineered as an advanced, heavy-duty environmental test chamber and precise climatic test chamber, it holds the Device Under Test (DUT) 100% stationary.

By utilizing high-velocity pneumatic air dampers to flash-route independent, pre-conditioned hot, cold, or ambient airstreams into the testing zone in under 10 seconds, it delivers intense thermal shock stress with zero physical vibration, safeguarding delicate signaling architectures while isolating micro-voids and encapsulation flaws smoothly.

Thermal Shock Test Chamber

Three-Zone Thermal Shock Test Chamber (Stationary Sample Air-Damper Configuration)

Three zone Thermal Shock Test Chamber

Advanced Technical Advantages


  • Stationary Specimen Integrity: Keeps test objects completely immobile during full-cycle runs, eliminating cable tangling and artificial structural shock, making it optimized for complex live-load electronic configurations.
  • Dynamic Damper Vectoring: This climatic test chamber utilizes specialized low-inertia pneumatic dampers that toggle air paths within seconds, generating high-velocity thermal shockwaves without cross-zone air leakage.
  • Triple-Zone Heat Storage Matrix: This environmental test chamber features independent hot, cold, and ambient chambers, ensuring massive thermal capacity is pre-stowed and deployed dynamically to guarantee elite stabilization thresholds.

  • Adaptive Ambient Dwell Logic: Delivers precise atmospheric air-purge balancing to isolate ambient dwell hold intervals, satisfying specific defense and automotive thermal profiling constraints.
Three zone Thermal Shock Test Chamber

Application Fields of Thermal Shock Test Chamber


  • Active Wired Communication Modules & High-Frequency Sensor Arrays: Subjects radar units, electronic smart locks, and telemetry logic blocks to rigorous thermal profiles without risking cable twisting, maintaining clean characteristic impedance traces.
  • Heavy Battery Modules & Scalable Power Infrastructure: Houses high-thermal-mass component lots that exceed the lifting weight boundaries of moving baskets, conducting intense stress testing on stable, heavy-duty floor grids.
  • Flip-Chip BGA Arrays & Micro-Pitch Silicon Packaging: Tests brittle wafer-level micro-bumps and continuous gold lead wires against non-linear thermal contractions without injecting mechanical rattling profiles.

  • Aerospace Guidance Controllers & Unpressurized Mission Computers: Simulates the aggressive transitions between extreme stratospheric freezing, unpressurized heating, and ground ambient holding phases to lock structural security constraints.


Three zone Thermal Shock Test Chamber

International Standards & Compliance Matrix


  • MIL-STD-883K Method 1010.8: Temperature Cycling for Microelectronic Devices (Outlines strict zone transition profiles and specific ambient dwell durations inside the environmental test chamber layout to isolate packaging fatigue).
  • JEDEC JESD22-A104F: Semiconductor Temperature Cycling Parameters (Governs rigid thermal soak tracking and recovery metrics across the stationary climatic test chamber boundaries to evaluate logic wafer failures).
  • IEC 60068-2-14 Test Na: IEC 60068-2-14 Test Na (DBenchmarks cross-zone thermal bleeding limits and pneumatic damper tracking across the environmental test chamber automatic validation loops).
  • IPC-9592B Class II: Requirements for Power Conversion Devices (Mandates explicit, heavy thermal shock trajectories inside the climatic test chamber footprint to surface component potting layer fractures).
  • AEC-Q100 Rev-H Test Group A: Automotive Semiconductor Preconditioning Profiles (Specifies accelerated thermomechanical degradation screening inside the environmental test chamber to evaluate interface safety bounds).


Three zone Thermal Shock Test Chamber

Control System Of The Test Chamber

The control system of the Sanwood test chamber adopts the world's leading software and hardware system to ensure that the test chamber operates under preset conditions, provide accurate and reliable experimental data, and help users achieve precise control and data collection of various experimental conditions.

  • Controller: It adopts the controller imported from South Korea Sanwon and the self-developed control system, which can be equipped with Siemens control system and equipped with RS232, RS485 and Ethernet communication ports.
  • Programmable control: It supports setting experimental programs, such as heating, cooling, constant temperature time, etc., and can execute multiple program settings, and supports advance reservation startup function.
  • Multiple languages optional: English, Korean, Russian, Chinese and Japanese.
  • Remote monitoring: Using network remote technology to achieve remote control, the test chamber can be monitored at any time, and the current data can be viewed through the user's PC and mobile phone, which improves the convenience of testing.

The specific control system of the test chamber will vary depending on the model. Please read the "Sanwood Environmental Test Chamber Manual" carefully before use and comply with the safety operating procedures.

Three zone Thermal Shock Test Chamber

Refrigeration System Of The Test Chamber

The refrigeration system of the test chamber is a complex and important system. The stability of the refrigeration system is crucial to the accuracy and reliability of the test results.

  • Sanwood Technology has developed a refrigerant hot gas defrosting technology, which effectively melts the frost on the evaporator by injecting high-temperature and high-pressure refrigerant steam into the heat exchanger in the test chamber. This not only ensures that the evaporator does not frost, but also greatly reduces the energy consumption of the equipment.
  • The refrigeration unit adopts an internationally renowned brand.
  • Optimize the layout of the refrigeration system, and adopt VRF (refrigerant flow control) technology based on the PID cold end output principle to achieve low-temperature energy-saving operation, which can reduce energy consumption by 30% under low-temperature conditions.
  • The refrigeration system adopts a modular design, with low failure rate, few welding points, high refrigeration efficiency, good reliability, simple maintenance, and low maintenance cost.


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Thermal Shock Test Chambers
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